H20E Epo-Tek^®Conductive adhesiveConductive silver epoxy resin paste

Mixing ratioSilver Tree Fat Cream /Liquid hardener:1：1.

100% Solid, two-component silver epoxy paste, with soft, smooth, and thixotropic properties (viscosity can be reduced when stirred or shaken), making it particularly suitable for chip bonding in microelectronics and optoelectronics applications. It has good processing performance and a long lifespan at room temperature. Suitable for applications that require rapid curing, such as fast circuit repair, screen printing, etc., capable of withstanding temperatures up to400°C.

Curing time (Minimum bonding temperature/time)
175°C ........ 45 seconds
150°C .......... five minute
120°C ........ fifteenminute
80°C......... ninetyminute

characteristic:
• Electrical resistivity:0.16 ohms/sq/mil
• Continuous use temperature:200°C
• Degradation temperature:410°C
• Refrigeration: No need.
• Low viscosity:2000cps

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